Method of manufacturing a thin-film magnetic head

ABSTRACT

A thin-film magnetic head is manufactured as follows. First, a base insulating layer having a magnetic pole forming depression sunken into a form corresponding to the main magnetic pole layer is formed, a stop film for CMP is formed such as to fill the magnetic pole forming depression, and then a magnetic layer is formed on the stop film. Next, the magnetic layer is separated by forming a separation groove substantially surrounding the magnetic pole forming depression on the outside thereof, and thus separated magnetic layer is formed with a cover insulating film adapted to cover the whole upper face. The surface is polished by CMP until the stop film is exposed, so that the part of magnetic layer remaining on the inside of the magnetic pole forming depression is used as the main magnetic pole layer. Further, a recording gap layer, a write shield layer, and a thin-film coil are formed.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a thin-film magnetic head whichperforms magnetic recording operations by perpendicular recordingschemes, a method of manufacturing the same, a head gimbal assembly andhard disk drive.

2. Related Background Art

In recent years, the areal density in hard disk drives has beenincreasing remarkably. Recently, the areal density in hard disk driveshas reached 160 to 200 GB/platter in particular, and is about toincrease further. Accordingly, thin-film magnetic heads have beenrequired to improve their performances.

In terms of recording schemes, thin-film magnetic heads can roughly bedivided into those for longitudinal recording in which information isrecorded in a (longitudinal) direction of a recording surface of a harddisk (recording medium) and those for perpendicular recording in whichdata is recorded while the direction of recording magnetization formedin the hard disk is perpendicular to the recording surface. As comparedwith the thin-film magnetic heads for longitudinal recording, thethin-film magnetic heads for perpendicular recording have beenconsidered more hopeful, since they can realize a much higher recordingdensity while their recorded hard disks are less susceptible to thermalfluctuations.

Conventional thin-film magnetic heads for perpendicular recording aredisclosed, for example, in U.S. Pat. No. 6,504,675, U.S. Pat. No.4,656,546, U.S. Pat. No. 4,672,493, and Japanese Patent ApplicationLaid-Open No. 2004-94997.

Meanwhile, when thin-film magnetic heads for perpendicular recordingrecord data onto areas in inner and outer peripheries of a hard disk, amagnetic pole end part disposed on the side of a medium-opposing surface(also referred to as air bearing surface, ABS) opposing the recordingmedium (hard disk) yields a certain skew angle with respect to a datarecording track. In perpendicular magnetic recording heads (hereinafteralso referred to as “PMR”) having a high writing capability, the skewangle has caused a problem of so-called side fringe in which unnecessarydata are recorded between adjacent tracks. The side fringe adverselyaffects the detection of servo signals and the S/N ratio of reproducedwaveforms. Therefore, in conventional PMRs, the magnetic pole end parton the ABS side in the main magnetic pole layer has a bevel formgradually narrowing in width toward one direction (see, for example,Japanese Patent Application Laid-Open Nos. 2003-242607 and 2003-203311in this regard).

Since it is necessary to move the magnetic head when writing data onto arecording medium, eliminate the above-mentioned problem of side fringeand the problem of erasing data in adjacent tracks, and so forth, thebevel angle (θ shown in FIG. 19) in conventional PMRs has been setwithin the range of 5 to 12 degrees.

Such a PMR has been formed as follows, for example. A method ofmanufacturing a conventional PMR will now be explained with reference toFIGS. 18 to 21. First, as shown in FIG. 18, a seed layer 401 is formedon an insulating layer 400 made of alumina or the like. Next, a resistpattern 402 provided with a tapered depression corresponding to a bevelangle is selectively formed, and a magnetic layer 403 is formed byplating with a magnetic material such as FeNi, CoNiFe, or CoFe so as tofill the tapered depression. Subsequently, the resist pattern 402 isremoved, and the seed layer 401 is etched by ion beam etching(hereinafter referred to as “IBE”), whereby a main magnetic pole layerhaving a magnetic pole end part 404 is formed as shown in FIG. 19.

OBJECT AND SUMMARY OF THE INVENTION

Since the magnetic pole end part 404 is formed into a bevel form asmentioned above, the track width varies depending on the height andbevel angle of the magnetic pole end part 404 in the conventional PMRs.Therefore, the height and width of the magnetic pole end part 404 havebeen determined by chemical mechanical polishing (hereinafter referredto as “CMP”) and photolithography, respectively, so as to yield anassumed track width, which makes it necessary for the magnetic pole endpart 404 to adjust its height and width to appropriate values.

In the conventional technique, however, the thickness of the magneticlayer 403 has varied within a wafer, thereby making the height of themagnetic pole end part 404 in each main magnetic pole layer within thewafer variable and uneven. This makes it necessary to polish the wholewafer such that the magnetic pole end part 404 has a uniform height. Aprocedure therefor is as follows, for example.

First, as shown in FIG. 20, selective wet etching is performed, so as toremove the magnetic layer 403 and seed layer 401 from field areas farranged on both sides of the magnetic pole end part 404. Next, analuminum film 405 is formed by a thickness of about 0.35 μm. Then, a Tafilm 406 as a stopper for CMP is formed by a thickness of 400 to 600 Åon both sides of the magnetic pole end part 404. Thereafter, an aluminumfilm 407 is formed by a thickness of about 6000 Å.

Next, the aluminum film 407 is polished by CMP until the Ta film 406acting as the stopper is exposed. However, there have been cases wherethe polishing advances so much that the height of the magnetic pole endpart 404 and its surroundings is lower by about 1500 Å than the Ta film406 as shown in FIG. 21, since the aluminum film 405 fails to have afavorable evenness in its thickness. Such a drop in thickness is formedby over-polish of CMP. However, it becomes difficult to adjust the dropin height when the Ta film 406 is distanced from the magnetic pole endpart 404 so that the interval between the Ta films 406 is large.

Therefore, when a polishing by CMP is performed from the state shown inFIG. 22(A) in the conventional PMRs, the height of the magnetic pole endpart 404 may become shorter than the assumed height because ofover-polish as shown in FIG. 22(B) or, on the contrary, higher than theassumed height because of shortage in polishing as shown in FIG. 22(C),thus making the magnetic pole end part 404 more likely to fluctuate itsheight. As a consequence, the width of the magnetic pole end part 404may become W1 (in the case of FIG. 22(B)) or W2 (in the case of FIG.22(C)), thereby generating fluctuations. As shown in FIGS. 22(B) and(C), the higher the magnetic pole end part 404 is, the wider themagnetic pole end part 404 becomes, thereby increasing the track width;the lower the magnetic pole end part 404 is, the narrower the magneticpole end part 404 becomes, thereby reducing the track width.

As in the foregoing, the conventional techniques have been problematicin that the magnetic pole end part 404 is likely to fluctuate its heighteven when polished by CMP in order for the magnetic pole end part 404 toattain a uniform height. When the height of the magnetic pole end part404 fluctuates, the width of the magnetic pole end part 404 varies,whereby the track width fluctuates as well. Therefore, the conventionalPMRs have been problematic in that they are hard to form the magneticpole end part 404 with a uniform size so as not to generatefluctuations, whereby their yield is very low.

The following manufacturing method may be considered, for example, foreliminating the unevenness in size of the magnetic pole end partmentioned above. This is a manufacturing method in which an insulatinglayer is formed with a depression conforming to the size of the mainmagnetic pole layer before forming a magnetic layer, and the magneticlayer is formed by plating over the whole upper face of the insulatinglayer such that a magnetic material fills the depression.

When forming a PMR by this manufacturing method, however, an unnecessarysurplus magnetic layer is also formed on the outside of the depressionand must be removed by CMP or the like. The magnetic layer remains onthe whole upper face of the insulating layer when performing CMP,whereby the area of the magnetic layer to be subjected to CMP is large.Therefore, the rate at which the magnetic layer is removed by CMP is soslow that the amount of polishing is hard to adjust finely, which makesit nearly impossible to remove the surplus magnetic layer uniformly.Consequently, the amount of polishing may vary among the PMRs formed onthe wafer, whereby it has been impossible for the magnetic pole end partto achieve a uniformity in size. Hence, even this manufacturing methodhas failed to achieve the task of forming the magnetic pole end part inconformity to the assumed uniform size without generating fluctuations.

For achieving the above-mentioned task, it is an object of the presentinvention to provide a thin-film magnetic head for performing a magneticrecording operation by a perpendicular recording scheme, a method ofmanufacturing the same, a head gimbal assembly, and a hard disk drive,in which a main magnetic pole layer is formed with a uniform sizewithout generating fluctuations, thus attaining a favorable yield.

For attaining the above-mentioned object, in one aspect, the presentinvention provides a thin-film magnetic head having a structure in whicha main magnetic pole layer including a magnetic pole end part on a sideof a medium-opposing surface opposing a recording medium, a write shieldlayer opposing the magnetic pole end part so as to form a recording gaplayer on the medium-opposing surface side, and a thin-film coil woundabout the write shield layer or main magnetic pole layer are laminated;wherein the main magnetic pole layer is incorporated in a magnetic poleforming depression of a base insulating layer, the magnetic pole formingdepression being sunken into a form corresponding to the main magneticpole layer; and wherein the thin-film magnetic head has a remnantinsulating film, formed on the outside of the magnetic pole formingdepression so as to substantially surround the magnetic pole formingdepression, covering the base insulating layer.

A remnant coating made of Ta, Ru, W, Ti, Cr, NiCr, or the like may beformed in a part between the magnetic pole forming depression andremnant insulating film on a surface of the base insulating layer.

In another aspect, the present invention provides a thin-film magnetichead having a structure in which a main magnetic pole layer including amagnetic pole end part on a side of a medium-opposing surface opposing arecording medium, a write shield layer opposing the magnetic pole endpart so as to form a recording gap layer on the medium-opposing surfaceside, and a thin-film coil wound about the write shield layer or mainmagnetic pole layer are laminated; wherein the main magnetic pole layeris incorporated in a magnetic pole forming depression of a baseinsulating layer, the magnetic pole forming depression being sunken intoa form corresponding to the main magnetic pole layer; wherein thethin-film magnetic head has a remnant insulating film, formed on theoutside of the magnetic pole forming depression so as to substantiallysurround the magnetic pole forming depression, covering the baseinsulating layer, whereas a surface of the remnant insulating film and asurface of the main magnetic pole layer are formed flat without a step;and wherein the recording gap layer is formed on the surface of theremnant insulating film and the surface of the main magnetic pole layer.

A remnant coating made of Ta, Ru, W, Ti, Cr, NiCr, or the like may beformed in a part between the magnetic pole forming depression andremnant insulating film on a surface of the base insulating layer, andthe recording gap layer may be formed on the remnant coating in thisthin-film magnetic head as well.

Preferably, an outer peripheral distance indicating a gap between themagnetic pole forming depression and the remnant insulating film is setwithin the range of 10 to 1000 μm.

In still another aspect, the present invention provides a method ofmanufacturing a thin-film magnetic head having a structure in which amain magnetic pole layer including a magnetic pole end part on a side ofa medium-opposing surface opposing a recording medium, a write shieldlayer opposing the magnetic pole end part so as to form a recording gaplayer on the medium-opposing surface side, and a thin-film coil woundabout the write shield layer or main magnetic pole layer are laminated,the method comprising the steps of forming a base insulating layerhaving a magnetic pole forming depression sunken into a formcorresponding to the main magnetic pole layer; forming a stop film forCMP on the base insulating layer such that the stop film enters themagnetic pole forming depression and then forming a magnetic layer onthe stop film; separating the magnetic layer by forming a separationgroove substantially surrounding the magnetic pole forming depression onthe outside thereof; forming a cover insulating film adapted to coverthe whole upper face of the magnetic layer separated by the separationgroove; polishing a surface by CMP until the stop film is exposed, sothat a part of the magnetic layer remaining on the inside of themagnetic pole forming depression is used as the main magnetic polelayer; and forming the recording gap layer, write shield layer, andthin-film coil.

This manufacturing method separates the magnetic layer by forming aseparation groove before polishing the magnetic layer by CMP.

In still another aspect, the present invention provides a method ofmanufacturing a thin-film magnetic head having a structure in which amain magnetic pole layer including a magnetic pole end part on a side ofa medium-opposing surface opposing a recording medium, a write shieldlayer opposing the magnetic pole end part so as to form a recording gaplayer on the medium-opposing surface side, and a thin-film coil woundabout the write shield layer or main magnetic pole layer are laminated,the method comprising the steps of forming a base insulating layerhaving a magnetic pole forming depression sunken into a formcorresponding to the main magnetic pole layer; forming a stop film forCMP on the base insulating layer such that the stop film enters themagnetic pole forming depression and then forming a magnetic layer onthe stop film; forming a separation groove substantially surrounding themagnetic pole forming depression on the outside thereof, so that, of themagnetic layer separated by the separation groove, a part on the insideof the separation groove is used as a remnant magnetic layer while apart on the outside of the separation groove is used as an outermagnetic layer; removing the outer magnetic layer, so as to leave theremnant magnetic layer; forming a cover insulating film adapted to coverthe whole upper face including the remnant magnetic layer and separationgroove; polishing a surface by CMP until the stop film is exposed, sothat a part of the magnetic layer remaining on the inside of themagnetic pole forming depression is used as the main magnetic polelayer; and forming the recording gap layer, write shield layer, andthin-film coil.

This manufacturing method separates the magnetic layer by forming aseparation groove before polishing the magnetic layer by CMP, andremoves the part of thus separated magnetic layer on the outside of theseparation groove.

When the part of remnant magnetic layer remaining on the inside of themagnetic pole forming depression is used as the main magnetic pole layerin this manufacturing method, the part of cover insulating filmremaining on the inside of the separation groove may be used as aremnant insulating film.

When the part of magnetic layer remaining on the inside of the magneticpole forming depression is used as the main magnetic pole layer in thismanufacturing method, a height of the main magnetic pole layer may befinely adjusted by IBE, so as to remove the stop film.

In the step of removing the outer magnetic layer, so as to leave theremnant magnetic layer, the stop film may be left.

Preferably, the separation groove is formed such that an outerperipheral distance indicating a gap between the magnetic pole formingdepression and the remnant insulating film is set within the range of 10to 1000 μm.

More preferably, the separation groove is formed such that an outerperipheral distance indicating a gap between the magnetic pole formingdepression and the remnant insulating film is set within the range of 15to 200 μm.

The separation groove may be formed such that a width of the separationgroove falls within the range of 5 to 20 μm.

In still another aspect, the present invention provides a head gimbalassembly comprising a support, a thin-film magnetic head formed on thesupport, and a gimbal securing the support; the thin-film magnetic headhaving a structure in which a main magnetic pole layer including amagnetic pole end part on a side of a medium-opposing surface opposing arecording medium, a write shield layer opposing the magnetic pole endpart so as to form a recording gap layer on the medium-opposing surfaceside, and a thin-film coil wound about the write shield layer or mainmagnetic pole layer are laminated; wherein the main magnetic pole layeris incorporated in a magnetic pole forming depression of a baseinsulating layer, the magnetic pole forming depression being sunken intoa form corresponding to the main magnetic pole layer; wherein thethin-film magnetic head has a remnant insulating film, formed on theoutside of the magnetic pole forming depression so as to substantiallysurround the magnetic pole forming depression, covering the baseinsulating layer, whereas a surface of the remnant insulating film and asurface of the main magnetic pole layer are formed flat without a step;and wherein the recording gap layer is formed on the surface of theremnant insulating film and the surface of the main magnetic pole layer.

In still another aspect, the present invention provides a hard diskdrive comprising a head gimbal assembly having a thin-film magnetic headand a recording medium opposing the thin-film magnetic head; thethin-film magnetic head having a structure in which a main magnetic polelayer including a magnetic pole end part on a side of a medium-opposingsurface opposing a recording medium, a write shield layer opposing themagnetic pole end part so as to form a recording gap layer on themedium-opposing surface side, and a thin-film coil wound about the writeshield layer or main magnetic pole layer are laminated; wherein the mainmagnetic pole layer is incorporated in a magnetic pole formingdepression of a base insulating layer, the magnetic pole formingdepression being sunken into a form corresponding to the main magneticpole layer; wherein the thin-film magnetic head has a remnant insulatingfilm, formed on the outside of the magnetic pole forming depression soas to substantially surround the magnetic pole forming depression,covering the base insulating layer, whereas a surface of the remnantinsulating film and a surface of the main magnetic pole layer are formedflat without a step; and wherein the recording gap layer is formed onthe surface of the remnant insulating film and the surface of the mainmagnetic pole layer.

The present invention will be more fully understood from the detaileddescription given hereinbelow and the accompanying drawings which aregiven by way of illustration only, and thus are not to be considered aslimiting the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of the thin-film magnetic head in accordancewith an embodiment of the present invention taken along a directionintersecting a thin-film coil;

FIG. 2 is a sectional view assuming a state where the thin-film magnetichead in accordance with the embodiment of the present invention is cutat an ABS during the course of its manufacture;

FIG. 3 is a sectional view showing a step subsequent to FIG. 2;

FIG. 4 is a sectional view showing a step subsequent to FIG. 3;

FIG. 5 is a sectional view showing a step subsequent to FIG. 4;

FIG. 6 is a sectional view showing a step subsequent to FIG. 5;

FIG. 7 is a sectional view showing a step subsequent to FIG. 6;

FIG. 8 is a sectional view showing a step subsequent to FIG. 7;

FIG. 9 is a sectional view showing a step subsequent to FIG. 8;

FIG. 10 is a plan view corresponding to FIG. 4;

FIG. 11 is a plan view corresponding to FIG. 5;

FIG. 12 is a view showing an insulating layer corresponding to FIG. 2,in which (A) is a plan view, whereas (B) is a sectional view taken alongthe line B-B of (A);

FIG. 13 is a view enlarging a main part of FIG. 12 with changed ratiosof dimensions, in which (A) is a plan view, (B) is a sectional viewassuming a state cut at the ABS 15 in (A), and (C) is a sectional viewenlarging a main part in (B);

FIG. 14 is a view showing a process of manufacturing a thin-filmmagnetic head while shortening the outer peripheral distance, in which(A) is a plan view, whereas (B) is a sectional view taken along the lineB-B of (A);

FIG. 15 is a plan view corresponding to FIG. 10 in the case ofmanufacturing a thin-film magnetic head by forming a separation groovehaving a different form;

FIG. 16 is a sectional view showing a step corresponding to FIG. 6during the course of manufacturing the thin-film magnetic head inaccordance with the embodiment of the present invention by anothermanufacturing method;

FIG. 17 is a perspective view showing a hard disk drive equipped withthe thin-film magnetic head in accordance with the embodiment of thepresent invention;

FIG. 18 is a sectional view assuming a state where a thin-film magnetichead is cut at the ABS during the course of its manufacture by aconventional manufacturing method;

FIG. 19 is a sectional view showing a step subsequent to FIG. 18;

FIG. 20 is a sectional view showing a procedure of making a magneticpole end part attain a uniform height while assuming the state of beingcut at the ABS;

FIG. 21 is a sectional view showing a state subsequent to FIG. 20; and

FIG. 22 is a sectional view showing a procedure of making the magneticpole end part attain a uniform height while assuming the state of beingcut at the ABS, in which (A), (B), and (C) show respective cases priorto CMP, where CMP advances too much, and where CMP is in short.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the following, embodiments of the present invention will be explainedwith reference to the drawings. Constituents identical to each otherwill be referred to with numerals identical to each other withoutrepeating their overlapping descriptions.

Method of Manufacturing a Thin-Film Magnetic Head

With reference to FIGS. 1 to 16, a method of manufacturing a thin-filmmagnetic head in accordance with the present invention will beexplained.

The thin-film magnetic head manufactured by the method of manufacturinga thin-film magnetic head in accordance with the present inventionencompasses a type (type 1) in which a thin-film coil is wound about amain magnetic pole layer and a type (type 2) in which the thin-film coilis wound about a write shield layer. The following explanation will setforth a method of manufacturing a thin-film magnetic head 300 of theformer type (type 1) shown in FIG. 1 by way of example.

As shown in FIG. 1, the thin-film magnetic head 300 has a structure inwhich a main magnetic pole layer 10 including a magnetic pole end part11 on a side of an ABS 15 as a medium-opposing surface opposing arecording medium, a write shield layer 13 opposing the magnetic pole endpart 11 so as to form a recording gap layer 12 on the ABS 15 side, and athin-film coil 100 wound about the main magnetic pole layer 10 and anupper magnetic pole layer 14 connected to the upper side of the mainmagnetic pole layer 10 are laminated.

When manufacturing the thin-film magnetic head 300 by the manufacturingmethod in accordance with the present invention, a laminated layerstructure 60 comprising a reproducing head such as MR device(magnetoresistive device) and a plurality of shied layers and the like(see FIG. 1) are formed on an undepicted substrate made of aluminumoxide-titanium carbide (Al₂O₃.TiC), for example. An insulating layer 61made of alumina is formed thereon, and the part of thin-film coil 100under the main magnetic pole layer 10 is formed on the upper side of theinsulating layer 61. Next, an insulating layer 1 is formed from alumina(Al₂O₃) or a nonmagnetic material. FIGS. 2 to 9 show steps after formingthe insulating layer 1. FIGS. 2 to 9 omit the construction (such as thelaminated layer structure 60) on the lower side of the insulating layer1.

FIG. 1 is a sectional view of the thin-film magnetic head 300 takenalong a direction intersecting the thin-film coil. FIGS. 2 to 9 aresectional views assuming states where the thin-film magnetic head 300 iscut at the ABS 15 during the course of its manufacture. FIG. 10 is aplan view corresponding to FIG. 4 during the course of manufacturing thethin-film magnetic head 300, whereas FIG. 11 is a plan view similarlycorresponding to FIG. 5. FIG. 12 is a view showing the insulating layercorresponding to FIG. 2, in which (A) is a plan view, whereas (B) is asectional view taken along the line B-B of (A). FIG. 13 is a viewenlarging a main part of FIG. 12 with changed ratios of dimensions, inwhich (A) is a plan view, (B) is a sectional view assuming a state cutat the ABS 15 in (A), and (C) is a sectional view enlarging a main partin (B).

Next, a coating 2 made of Ta or Ru is formed on the insulating layer 1by a thickness of 200 to 1000 Å. (The coating 2 may be formed from notonly Ta and Ru, but also W, Ti, Cr, NiCr, and the like.) Further, aftera photoresist is applied onto the whole surface, patterning is performedwith a predetermined photomask, so as to form a resist pattern 3exposing the surface of the insulating layer 1 into a form correspondingto a cavity 20 which will be explained later. Then, using the resistpattern 3 as a mask, IBE or reactive ion etching (hereinafter referredto as “RIE”) is performed, so as to remove the part of coating 2 notcovered with the resist pattern 3, and the part of insulating layer 1not covered with the resist pattern 3. This forms the cavity 20 in theinsulating layer 1 shown in FIGS. 12 and 13. In this case, RIE isperformed alone when the coating 2 is made of Ta. When the coating 2 ismade of Ru, the coating 2 and the insulating layer 1 are removed by IBEand RIE, respectively. When performing RIE, the part of cavity 20corresponding to the magnetic pole end part 11 is formed into a taperhaving a bevel angle of about 7 to 10 degrees while using a mixed gas ofCl₂, BCl₃, and CF₄. Thus forming the cavity 20 allows the insulatinglayer 1 to become a base insulating layer in the present invention.

The cavity 20 is a magnetic pole forming depression in the presentinvention, which is made by partly depressing the insulating layer 1into a form corresponding to the outer form of the main magnetic layer10 in order to make the main magnetic layer 10 with set dimensions andshape (the hatched part in (A) of FIGS. 12 and 13 indicating the cavity20) as shown in FIGS. 12 and 13. Namely, as will be explained later indetail, the cavity 20 is formed prior to the main magnetic pole layer10, so as to have a depth d1 (about 0.25 to 0.35 μm, preferably 0.3 μm),dimensions including width and length, and a shape which coincide withthe assumed thickness, width, and length of the main magnetic layer 10.

The cavity 20 includes a very narrow groove 23 formed so as to definethe track width of the thin-film magnetic head 300; a variable widthdepression 24, connected to the very narrow groove 23, having agradually increasing groove width; a fixed width depression 25,connected to the variable width depression 24, having a fixed groovewidth; and a protruded depression 26 connected to the end part of thenarrow groove part 23 opposite from the variable width depression 24. Aremnant magnetic layer 31, which will be explained later, filling thecavity 20 forms the main magnetic layer 10.

Next, as shown in FIG. 3, a CVD film 4 made of alumina (Al₂O₃) is formedby an atomic layer method so as to enter the cavity 20 in order toadjust the track width. (A conductive film made of Ta, Ru, W, TiW, TiN,or the like may be formed instead of the CVD film 4 by the atomic layermethod as well.) The thickness of the CVD film 4 or conductive filmcorresponds to the track width and is usually about 200 to 500 Å. On theupper side of the CVD film 4 or conductive film, a stopper 5 which willlater be used as a stop film for CMP is formed from Ta or Ru (by athickness of about 300 to 600 Å). When a conductive film of the samespecies as with the stopper 5 made of Ta, Ru, or the like is formed inorder to adjust the track width, this conductive film substitutes forthe stopper 5, thus making it unnecessary to newly form the stopper 5.In this case, the conductive film is used as a stop film. On the stopper5, a plated seed layer 6 is formed by sputtering with CoFe (24T),CoNiFe, or NiFe. Then, the whole surface of the substrate iselectrolytically plated with a magnetic material such as CoNiFe or CoFe,so as to form a plated magnetic layer 7 having a thickness of about 0.5to 1.2 μm. The electrolytic plating over the whole surface canaccurately control the composition of the plated magnetic layer 7 to aleading end part within the cavity 20.

Subsequently, after a photoresist is applied to the whole upper face ofthe plated magnetic layer 7, patterning is performed with apredetermined photomask, so as to expose the surface of the platedmagnetic layer 7 into a form corresponding to a separation groove 30,which will be explained later, as shown in FIG. 3, thereby yielding aresist pattern 8.

Next, IBE is performed while using the resist pattern 8 as a mask, so asto remove the respective parts not covered with the resist pattern 8 inthe layers (coating 2, CVD film 4, stopper 5, and seed layer 6) from theplated magnetic layer 7 to the coating 2. Then, the separation groove 30is formed as shown in FIGS. 4 and 10. The separation groove 30 is formedinto a band form having a width W30 (e.g., on the order of 5 to 20 μm)so as to substantially surround the periphery of the cavity 20 along theouter form of the cavity 20 on the outside of the cavity 20. Theseparation groove 30 having the width W30 on the order of 5 to 20 μm cankeep the stoppers 5 from increasing their intervals.

Since the separation groove 30 is formed along the outer form of thecavity 20, its part corresponding to the very narrow groove 23 has a gapW5 narrower than the gap W6 of the other parts (W5<W6). Thus forming theseparation groove 30 separates the plated magnetic layer 7 into an innerpart closer to the cavity 20 and a part on the outside of the cavity 20.(The hatched part of FIG. 10 indicates the plated magnetic layer 7,whereas the other part indicates the surface of insulating layer 1exposed by the separation groove 30.) The former separated from theplated magnetic layer 7 becomes the remnant magnetic layer 31 in thepresent invention, whereas the latter becomes an outer magnetic layer 32in the present invention. Since the separation groove 30 is formed byremoving the layers from the plated magnetic layer 7 to the coating 2,the surface of the insulating layer 1 is exposed into a formcorresponding to the shape of the separation groove 30. Since theremnant magnetic layer 31 is left, the coating 2 partly remains as aremnant coating 22 on the lower side of the remnant magnetic layer 31.The remnant coating 22 is formed in a part between the cavity 20 andseparation groove 30 on the surface of the insulating layer 1. While theremnant magnetic layer 31 is a magnetic layer required for forming themain magnetic layer 10, the outer magnetic layer 32 is a magnetic layerwhich is not necessary for forming the main magnetic layer 10.

When forming the separation groove 30, it is necessary that the resistpattern 8 be formed while being positioned such that an outer peripheraldistance d1 to d4 (see FIG. 10) indicating the gap between the cavity 20and separation groove 30 is secured by a necessary and sufficientamount. The shorter the outer peripheral distance d1 to d4 is, thesmaller the area of the remnant magnetic layer 31 becomes. This willremove the remnant magnetic layer 31 faster when polished by CMP in alater step, whereby the amount removed per unit time by polishing(hereinafter referred to as “polishing speed”) may become too higher inthe remnant magnetic layer 31 than in the whole plated magnetic layer 7.

For example, the polishing speed in the remnant magnetic layer 31becomes too fast in this case, so that the stopper 5 is exposed earlieras shown in FIGS. 14(A),(B). Since the outer magnetic layer 32 stillremains, however, the remnant magnetic layer 31 may disappear uponfurther polishing before the outer magnetic layer 32 is completelyremoved. Therefore, the polishing by CMP may advance too much in theremnant magnetic layer 31, thereby making it easier for the cavity 20 toincrease its sinking. Consequently, the height of magnetic pole end part11 cannot be adjusted favorably within the wafer, thus yielding placeswhere the track width is not uniform. When the outer peripheral distanced1 to d4 is too long, by contrast, the remnant magnetic layer 31 becomesgreater, so as to retard the polishing by CMP, thereby leaving anunpolished part, thus generating fluctuations in the amount ofpolishing. The amount of polishing is harder to adjust in this case aswell. Consequently, for forming the magnetic pole end part 11 with auniform size without fluctuations, the outer peripheral distance d1 tod4 is needed to be adjusted within an appropriate range.

In view of this point, the outer peripheral distance d1 to d4 is setwithin the range of about 40 to 50 μm. It has been verified that thereare no problems in practice even when the outer peripheral distance d1to d4 is about 200 μm or about 15 μm. However, the upper limit seems tobe about 1000 μm, since the polishing speed is harder to adjust when theouter peripheral distance d1 to d4 exceeds about 1000 μm. The lowerlimit seems to be about 10 μm, since the stopper 5 may be exposedearlier when the outer peripheral distance d1 to d4 is shorter thanabout 10 μm. From these points, it will be preferred if the outerperipheral distance d1 to d4 is set within the range of about 10 μm toabout 1000 μm. In this range, the outer peripheral distance d1 to d4 ispreferably set within the range of about 15 μm to about 200 μm inparticular, more preferably within the range of about 40 μm to about 50μm. When the outer peripheral distance d1 to d4 is set at least withinthe range of about 10 μm to about 1000 μm, the remnant magnetic layer 31having such a size as to be able to form the main magnetic layer 10 witha uniform size without fluctuations is obtained.

After thus separating the plated magnetic layer 7 into the remnantmagnetic layer 31 and outer magnetic layer 32 by forming the separationgroove 30, wet etching with nitric acid is performed before forming themain magnetic pole layer 10 by polishing with CMP, so as remove theouter magnetic layer 32, which is not required for forming the mainmagnetic pole layer 10, together with the seed layer 6 thereunder. Thisremoves the outer magnetic pole layer 32, thereby leaving the remnantmagnetic layer 31 and stopper 5 as shown in FIGS. 5 and 11. When theouter magnetic layer 32 is removed, the magnetic layer to be subjectedto CMP is only the remnant magnetic layer 31, which is smaller, wherebythe polishing speed of CMP increases, which makes it possible to adjustthe amount of polishing accurately. The outer magnetic layer 32, whichis not required for forming the main magnetic pole layer 10, greatlyaffects the polishing speed of CMP. Removing such an outer magneticlayer 32 before CMP stabilizes the polishing speed of CMP.

Though a manufacturing method leaving the outer magnetic layer 32 may beemployed as will be explained later, the polishing speed of CMP becomesslower, since the magnetic layer to be subjected to CMP is greater. Thismakes it harder to adjust the amount of polishing accurately, so that anunpolished part may occur, thereby unevenly polishing the surroundingsof the cavity 20. Therefore, it is desirable that the outer magneticlayer 32 be removed by wet etching or the like before polishing by CMP.

On the plated magnetic layer 7 (remnant magnetic layer 31 and outermagnetic pole 32) separated by the separation groove 30, a coverinsulating film 16 made of alumina adapted to cover the whole upper faceis formed by a thickness of about 0.5 to 1.2 μm, whereby the state shownin FIG. 6 is attained. Then, the whole substrate surface is polished byCMP until the stopper 5 is exposed, so as to remove the part of remnantmagnetic layer 31 on the outside of the cavity 20 together with the seedlayer 6 thereunder, thereby yielding the state shown in FIG. 7.

Thereafter, fine adjustment is effected by IBE, and the stopper 5 isremoved, whereby the part of remnant magnetic layer 31 left on theinside of the cavity 20 forms the main magnetic pole layer 10, thusyielding the state shown in FIG. 8. Here, the cover insulating film 16partly remains on the inside of the separation groove 30. The part ofcover insulating film 16 left on the inside of the separation groove 30becomes a remnant insulating film 17 in the present invention. Since thewhole substrate surface is polished by CMP until the stopper 5 isexposed, the surface of the remnant insulating film 17 and the surfaceof the main magnetic pole layer 10 are formed flat without a step. Sincethe cavity 20 is formed in conformity to dimensions assumed beforehand,thus formed main magnetic pole layer 10 has accurate dimensions.

As mentioned above, the separation groove 30 is formed, so as toseparate the plated magnetic layer 7 into the remnant magnetic layer 31and outer magnetic layer 32, the outer magnetic layer 32 not requiredfor forming the main magnetic layer 10 is removed, and then the wholesubstrate surface is polished by CMP, so as to form the main magneticpole layer 10. Removing the outer magnetic layer 32 beforehand decreasesthe magnetic layer to be subjected to CMP, thereby making it possible toaccurately adjust the amount of polishing by CMP. Since the outerperipheral distance is defined as mentioned above when forming theseparation groove 30, the remnant magnetic layer 31 is formed by a sizefalling within a range which does not hamper dimensional uniformity inthe main magnetic pole layer 10. These prevent the polishing speed ofCMP from fluctuating. This keeps the remnant magnetic layer 31 frombeing polished too much by CMP and from leaving an unpolished partbecause of shortage in polishing on the contrary, whereby the height ofthe main magnetic pole layer 10 can be adjusted accurately. Therefore,the magnetic pole end part 11 can attain an accurate, uniform trackwidth without fluctuations, whereby the main magnetic pole layer 10 isformed with a uniform size without fluctuations.

Subsequently, a recording gap layer 12 is formed on the main magneticpole layer 10 as shown in FIG. 9, and an upper magnetic pole layer 14 isformed together with a shield part 13 a by using CoNiFe or CoFe as amagnetic material so as to overlie the main magnetic pole layer 10 asshown in FIG. 1. Then, the part of thin-film coil 100 on the upper sideof the main magnetic pole layer 10 is formed, and a shield part 13 b isformed by using CoNiFe or CoFe as a magnetic material, so that theshield parts 13 a and 13 b construct a write shield layer 13. Further,an upper insulating layer 18 is formed, whereby the thin-film magnetichead 300 shown in FIG. 1 is obtained.

Modified Example 1

Though the above-mentioned manufacturing method performs the step ofremoving the outer magnetic layer 32 not required for forming the mainmagnetic pole layer 10, so as to attain the state shown in FIG. 5, nextafter the cover insulating film 16 is formed, then polishes the wholesubstrate surface by CMP, the thin-film magnetic head 300 may bemanufactured without performing the step of removing the outer magneticlayer 32. Namely, the step of separating the plated magnetic layer 7 byforming the separation groove 30 may be performed so as to attain thestate of FIGS. 4 and 10, and then the state of FIG. 16. In FIG. 16, thecover insulating film 16 is formed on the plated magnetic layer 7(remnant magnetic layer 31 and outer magnetic pole 32) separated by theseparation groove 30 while keeping the outer magnetic layer 32 frombeing removed. It will be sufficient if the whole substrate surface ispolished by CMP thereafter. The plated magnetic layer 7 is separatedinto the remnant magnetic layer 31 and outer magnetic pole 32 by formingthe separation groove 30 in this case as in the above-mentionedmanufacturing method. Therefore, when the whole substrate surface ispolished by CMP, the polishing by CMP advances from both of the end part20 a of the cavity 20 and the end part 30 a of the separation groove 30,so that the rate at which the plated magnetic layer 7 is removed bypolishing of CMP becomes stable, which makes it less likely for theremnant magnetic layer 31 to be polished too much by CMP or leave anunpolished part due to the shortage in polishing. Therefore, thismanufacturing method can also accurately adjust the height of themagnetic pole end parts 11, so that the magnetic pole end part 11 canattain an accurate, uniform track width without fluctuations.

Modified Example 2

Since the above-mentioned separation groove 30 is formed in conformityto the outer shape of the cavity 20, the gap W5 of the part of cavity 20corresponding to the very narrow groove 23 is narrower than the gap W6of the other parts. Instead of being formed as such, the separationgroove may be formed as a separation groove 40 shaped such that the gapof its part corresponding to the very narrow groove 23 has a gap W7substantially equal to the gap W6. When the plated magnetic layer 7 isseparated by forming the separation groove 40, the part of remnantmagnetic layer 31 arranged near the very narrow groove 23 becomesgreater than that in the case where the separation groove 30 is formed.This is effective in that the part to become the magnetic pole end part11 can be protected when polishing the plated magnetic layer 7 by CMP.

Characteristics of the Structure of the Thin-Film Magnetic Head 300

The thin-film magnetic head 300 is manufactured by the foregoingmanufacturing method and thus has the following characteristics. Namely,since the foregoing manufacturing method forms the main magnetic polelayer 10 by the part of remnant magnetic layer 31 left on the inside ofthe cavity 20, the main magnetic pole layer 10 is formed with accuratedimensions in the thin-film magnetic head 300. Also, the plated magneticlayer 7 is separated into the remnant magnetic layer 31 and outermagnetic layer 32, the cover insulating film 16 is formed after removingthe outer magnetic layer 32 or while keeping the outer magnetic layer32, and then the whole substrate surface is polished by CMP, so as toform the main magnetic pole layer 10. Therefore, the magnetic pole endpart 11 has an accurate, uniform track width without fluctuations,whereby the main magnetic pole layer 10 is formed with a uniform sizewithout generating fluctuations.

The thin-film magnetic head 300 is formed by way of such a step that theseparation groove 30 is formed so as to expose the surface of theinsulating layer 1 and then the cover insulating film 16 is formed,whereby the cover insulating film 16 partly enters the separation groove30. Consequently, the thin-film magnetic head 300 has theabove-mentioned remnant insulating film 17. The remnant insulating film17 is formed at a place where the separation groove 30 was formed in astep during the course of manufacture, and thus is arranged at aposition on the outside of the cavity 20 with an outer peripheraldistance therefrom as with the separation groove 30 so as to surroundthe cavity 20 along the outer shape thereof. The width of the remnantinsulating film 17 is the same as the width W30 of the separation groove30.

The thin-film magnetic head 300 is formed by way of such a step as tokeep the remnant magnetic layer 31. Therefore, the thin-film magnetichead 300 also has the above-mentioned remnant coating 22. Since the mainmagnetic pole layer 10 is formed by way of a step of polishing the wholesubstrate surface by CMP, the surface of the remnant insulating film 17and the surface of the main magnetic pole layer 10 are formed flatwithout a step. A recording gap layer 24 is formed on thus formed mainmagnetic pole layer 10, the remnant insulating film 17, and the remnantcoating 22.

Embodiments of Head Gimbal Assembly and Hard Disk Drive

Embodiments of head gimbal assembly and hard disk drive will now beexplained.

FIG. 17 is a perspective view showing a hard disk drive 201 equippedwith the above-mentioned thin-film magnetic head 300. The hard diskdrive 201 includes a hard disk (recording medium) 202 rotating at a highspeed and a head gimbal assembly (HGA) 215. The hard disk drive 201 isan apparatus which actuates the HGA 215, so as to record/reproducemagnetic information onto/from recording surfaces of the hard disk 202.The hard disk 202 has a plurality of (3 in the drawing) platters. Eachplatter has a recording surface opposing the thin-film magnetic head300. In the HGA 215, a gimbal 212 mounted with a head slider 211 havinga support formed with the thin-film magnetic head 300, and a suspensionarm 213 supporting the gimbal 212 are arranged at each of the recordingsurfaces of the platters, while being rotatable about a shaft 214 by avoice coil motor which is not depicted, for example. When the HGA 215 isrotated, the head slider 211 moves radially of the hard disk 202, i.e.,in directions across track lines.

Each of such HGA 215 and hard disk drive 201 has a thin-film magnetichead 300, whereby the main magnetic pole layer 10 is formed withaccurate dimensions, while the height of the main magnetic pole layer 10is an accurate, uniform value.

Though the above-mentioned embodiments describe the type (type 1) inwhich the thin-film coil is wound about the main magnetic pole layer byway of example, the present invention is also employable in thin-filmmagnetic heads of a type (type 2) in which the thin-film coil is woundabout a write shield layer.

It is apparent that various embodiments and modifications of the presentinvention can be embodied, based on the above description. Accordingly,it is possible to carry out the present invention in the other modesthan the above best mode, within the following scope of claims and thescope of equivalents.

1. A method of manufacturing a thin-film magnetic head having astructure in which a main magnetic pole layer including a magnetic poleend part on a side of a medium-opposing surface opposing a recordingmedium, a write shield layer opposing the magnetic pole end part so asto form a recording gap layer on the medium-opposing surface side, and athin-film coil wound about the write shield layer or main magnetic polelayer are laminated, the method comprising the steps of: forming a baseinsulating layer having a magnetic pole forming depression sunken into aform corresponding to the main magnetic pole layer; forming a stop filmfor CMP on the base insulating layer such that the stop film enters themagnetic pole forming depression and then forming a magnetic layer onthe stop film; removing part of the magnetic layer by forming aseparation groove substantially surrounding the magnetic pole formingdepression on an outside of the magnetic pole forming depression;forming a cover insulating film adapted to cover the whole upper face ofthe magnetic layer separated by the separation groove; polishing asurface by CMP until the stop film is exposed, so that a part of themagnetic layer remaining on an inside of the magnetic pole formingdepression is used as the main magnetic pole layer; and forming therecording gap layer, write shield layer, and thin-film coil.
 2. Themethod of manufacturing a thin-film magnetic head according to claim 1,wherein, when the part of magnetic layer remaining on the inside of themagnetic pole forming depression is used as the main magnetic polelayer, a part of the cover insulating film remaining on the inside ofthe separation groove is used as a remnant insulating film.
 3. Themethod of manufacturing a thin-film magnetic head according to claim 1,wherein, when the part of magnetic layer remaining on the inside of themagnetic pole forming depression is used as the main magnetic polelayer, a height of the main magnetic pole layer is finely adjusted byIBE, so as to remove the stop film.
 4. The method of manufacturing athin-film magnetic head according to claim 1, wherein the separationgroove is formed such that an outer peripheral distance indicating a gapbetween the magnetic pole forming depression and the separation grooveis set within the range of 10 to 1000 μm.
 5. The method of manufacturinga thin-film magnetic head according to claim 1, wherein the separationgroove is formed such that an outer peripheral distance indicating a gapbetween the magnetic pole forming depression and the separation grooveis set within the range of 15 to 200 μm.
 6. A method of manufacturing athin-film magnetic head having a structure in which a main magnetic polelayer including a magnetic pole end part on a side of a medium-opposingsurface opposing a recording medium, a write shield layer opposing themagnetic pole end part so as to form a recording gap layer on themedium-opposing surface side, and a thin-film coil wound about the writeshield layer or main magnetic pole layer are laminated, the methodcomprising the steps of: forming a base insulating layer having amagnetic pole forming depression sunken into a form corresponding to themain magnetic pole layer; forming a stop film for CMP on the baseinsulating layer such that the stop film enters the magnetic poleforming depression and then forming a magnetic layer on the stop film;forming a separation groove substantially surrounding the magnetic poleforming depression on an outside of the magnetic pole formingdepression, so that, of part of the magnetic layer removed by theforming of the separation groove, a part on the inside of the separationgroove is used as a remnant magnetic layer while a part on the outsideof the separation groove is used as an outer magnetic layer; removingthe outer magnetic layer, so as to leave the remnant magnetic layer;forming a cover insulating film adapted to cover the whole upper faceincluding the remnant magnetic layer and separation groove; polishing asurface by CMP until the stop film is exposed, so that a part of themagnetic layer remaining on an inside of the magnetic pole formingdepression is used as the main magnetic pole layer; and forming therecording gap layer, write shield layer, and thin-film coil.
 7. Themethod of manufacturing a thin-film magnetic head according to claim 6,wherein, when the part of remnant magnetic layer remaining on the insideof the magnetic pole forming depression is used as the main magneticpole layer, a part of the cover insulating film remaining on the insideof the separation groove is used as a remnant insulating film.
 8. Themethod of manufacturing a thin-film magnetic head according to claim 6,wherein, when the part of remnant magnetic layer remaining on the insideof the magnetic pole forming depression is used as the main magneticpole layer, a height of the main magnetic pole layer is finely adjustedby IBE, so as to remove the stop film.
 9. The method of manufacturing athin-film magnetic head according to claim 6, wherein, in the step ofremoving the outer magnetic layer, so as to leave the remnant magneticlayer, the stop film is left.
 10. The method of manufacturing athin-film magnetic head according to claim 6, wherein the separationgroove is formed such that an outer peripheral distance indicating a gapbetween the magnetic pole forming depression and the separation grooveis set within the range of 10 to 1000 μm.
 11. The method ofmanufacturing a thin-film magnetic head according to claim 6, whereinthe separation groove is formed such that an outer peripheral distanceindicating a gap between the magnetic pole forming depression and theseparation groove is set within the range of 15 to 200 μm.
 12. Themethod of manufacturing a thin-film magnetic head according to claim 6,wherein the separation groove is formed such that a width of theseparation groove falls within the range of 5 to 20 μm.